Matthias,
Check out Motorola's "End User Manual for CBGA and Plastic BGA Products"
and app note "AP1231". I have hard copies so I cant e-mail them to you.
Fuji-Poly makes compression BGA sockets. I do not have any experience
with them.

Scott Buscomb

Matthias Mansfeld wrote:

> Hello Designers,
>
> At first, please apologize cross-posting in DC, Technet and PCD list.
> It's a design AND assembly question.
>
> I have a Motorola MPC8260, in a BGA package TBGA480 37,5 x
> 37,5 (BGA with 480 balls in 5 rows, means 29x29 Matrix with 19x19
> free) with pitch 1,27 mm. The customer wants 3 prototype boards -
> means many profile tests or other scrap producing operatiins are not
> possible.
>
> Has anybody out there any good application notes or a URL at Motorola
> which goes especially to this package (I searched until I died, but
> found nothing special) or own good/bad experiences concerning layout
> and assembly?
>
> Has anybody experiences with "low-cost" BGA sockets from E-tec or
> other companies, especially with the E-Tec "screw-lock" solderless
> compression types (double-sided spring contacts between BGA & board
> with a standard BGA layout)? Any good/bad EMV experiences
> (signal/clock integrity) for higher clocked devices in these sockets?
> etc.
>
> Many thanks in advance, regards
> Matthias Mansfeld
> -----------------------------------------------
> Matthias Mansfeld Elektronik
> * Printed Circuit Board Design and Assembly
> Am Langhoelzl 11, D-85540 Haar, GERMANY
> Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
> E-Mail: [log in to unmask]
> Internet: http://www.mansfeld-elektronik.de