Hello Designers,

At first, please apologize cross-posting in DC, Technet and PCD list.
It's a design AND assembly question.

I have a Motorola MPC8260, in a BGA package TBGA480 37,5 x
37,5 (BGA with 480 balls in 5 rows, means 29x29 Matrix with 19x19
free) with pitch 1,27 mm. The customer wants 3 prototype boards -
means many profile tests or other scrap producing operatiins are not
possible.

Has anybody out there any good application notes or a URL at Motorola
which goes especially to this package (I searched until I died, but
found nothing special) or own good/bad experiences concerning layout
and assembly?

Has anybody experiences with "low-cost" BGA sockets from E-tec or
other companies, especially with the E-Tec "screw-lock" solderless
compression types (double-sided spring contacts between BGA & board
with a standard BGA layout)? Any good/bad EMV experiences
(signal/clock integrity) for higher clocked devices in these sockets?
etc.

Many thanks in advance, regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de