Hi Earl -
Ugly? Yes, but also rather impressive.  As for the partial solder flow thru,
IBM Owego had an angular x-ray set-up they used to employ to inspect and
accept similar for military applications.  (This was all back in the days
before dual waves and the wide variety of reflow soldering available today.

What's the resin system in your pride and joy, there?

Regards - Kelly

PS - I've just recently retired and joined the "Geezerhood of Consultants".




-----Original Message-----
From: pod <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, September 30, 1999 1:11 PM
Subject: Re: [TN] Wave soldering


>I mistakenly sent a pretty ugly picture of a x-section to Paul Classic and
>Big Steve Gregorme. It showed, for those of you not offended, a 30 plus
>layer board with about 5% filling in a board so thermally dense it froze
the
>solder pot. IPC cannot cover that. No one can unless it functions as the
>customer required and was willing to buy. However, this practice does not
>even come close to DFM/CE principles.
>
>Earl Moon
>----- Original Message -----
>From: Vincent BADA <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Wednesday, September 29, 1999 11:32 PM
>Subject: [TN] Wave soldering
>
>
>> Hi all,
>>
>> What is the minimum vertical fill of solder for plated through holes ?
>>
>> We have some problems to obtain the 75% requested by IPC-A-610 for a
class
>2
>> board.
>> In fact, the board has a thickness of 3,2 mm.
>> We use a no-clean flux and the wave is under nitrogen.
>>
>> Is there any special criteria regarding to the thickness of the board ?
>> Has anyone succeeded in obtaining a correct solder filet for thick boards
>?
>>
>> Thanks,
>>
>> Vincent Bada
>> Process Engineer
>> Alcatel Etca
>> Charleroi
>> Belgium
>>
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##############################################################
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information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
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