Is there anywhere I can obtain a model for predicting the life, strength, etc.
of a solder joint?  I would like to be able to input data one of two ways to
determine what I can expect.

1.  Can I input characteristics of the joint into some type of matrix i.e, hole
size, plating thk, hole fill, fillet concavity, and get a life prediction model?

2.  From FEM, obtain predicted overall stress and strain for the joint then
extrapolate out into some life prediction model for reliability.

My primary concern are joints on the bottomside of a PCB either from wave solder
or the paste-in-hole process.  I would appreciate direction or something
another.

Jason Smith
Process Materials Engineer
Lexmark Electronics

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