I'm having some trouble completely understanding what I think to be two
issues. One is a BGA installed on the interposer that is has columns
attached to the board surface.

We use such schemes down to .8 mm with over 1000 I/O's for very special,
"hand holding" processes. For pure ceramic column grid arrays (CCGA), we
obviously paste and reflow solder directly to the boards.

I guess I'm asking questions. Is what you need a function of the interposer
or the BGA? Also, what spacing is required and why the interposer, though I
believe I know that answer?

Earl Moon
----- Original Message -----
From: Kuczynski Michael <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 21, 1999 9:17 AM
Subject: [TN] Column Grid Array


> I'm looking for any help, suggestions or pitfalls in making a footprint
pattern
> and assembly processes for a column grid array.
>
> Its a ball grid array, except it sits on a socket type device (1.695mm
[.0667in]
> high max.) called a Solder Column Interposer. The overall height with the
bga is
> 4.04mm [.1590in]
>
> The device itself is cermaic.
>
> Thanks in Advance,
>
> Michael Kuczynski       Librarian/Sr. Designer
> Allied Signal           201-393-2122 (Phone)
> 699 Rt46E E/K4          201-393-2357 (Fax)
> Teterboro NJ 07608
> [log in to unmask]
> [log in to unmask]
>
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