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September 1999

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Subject:
From:
"Kluz, Allen E." <[log in to unmask]>
Date:
Fri, 17 Sep 1999 09:42:08 -0500
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Kluz, Allen E." <[log in to unmask]>
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Technetters,
I've been searching through the IPC-A-610: Acceptability of Electronic
Assemblies Guidelines, and can't find anything on guidelines for maximum
joint thickness (from the pad to the lead). The manual refers to as the "G"
dimension, which clearly identifies the minimum thickness'.  Does anyone
know of guideline for this and where it's stated?  I'm looking for a round
lead in particular.

Thanks in advance.


Allen Kluz
Supplier Quality Engineer
[log in to unmask]

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