TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Subject:
From:
Carl Ray <[log in to unmask]>
Date:
Sat, 11 Sep 1999 06:41:23 -0500
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Carl Ray <[log in to unmask]>
Parts/Attachments:
text/plain (25 lines)
Hey Guys,
Got a question. I have to start running some PCBs that have Organo-Metallic
Silver Immersion for plating. What are the pros and cons? Will I have to use
OA solder paste? Any information will be beneficial.
Carl Ray
Engineering  Supervisor
256-494-3247 Direct line
256-492-8997 ext. 272
256-494-0625 Fax
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2