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September 1999

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Sat, 4 Sep 1999 14:42:53 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, pod <[log in to unmask]>
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I probably don't understand all you said. However, I see on a daily basis
the virtual corporation far exceeding its limits and customer expectations.
I have worked many years in the military/aerospace industry in which DFM/CE
was practiced fairly well. In the age of this thing commercial, someone
(many of them) haven't a clue what to do.

I could go on about issues (not problems) being re-invented for the sake of
same. I mean, everyone works very hard to discover new ways to do old things
with even older stuff except equipment, tools, components, etc. Even all
that stuff is repeated endlessley.

I don't know about you, but my frustration is at an all time high because of
big folks getting bigger without enough regard for customer requirements.
Part of the blame is on the CM and part is on the customer wishing their
manufacturing operations would go to "qualified" CM's. Problem is, no one
knows what qualified is anymore.

There's so much more,

Earl Moon
----- Original Message -----
From: joyce <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, September 04, 1999 1:28 PM
Subject: Re: [TN] NEED SOME INPUTS


> Girlie,
> I gave a "hand waving" talk last July at local SMTA meeting, title
> "Challenge of 90s".  It was my personal opinion that the current business
> environemnt, such as Merge and acquisition, has large impact on the
> technical issues.  The key points are:
> (1) Product life expectancy v.s. components/material life cycles are widen
> dramatically (sorry, the drama is not a technical word, but when you see
the
> obsolecense notification of a plat form of components/materials, it is a
> dramatic experience...like "Ahhhh, beam me up").
> - product life - non-destructive testing and computer modelling in the
> nowadays allow the extention of the equipment beyond their designed
> life...Particularly, the high price items, like airplane, train, major
> electronic equipment, etc.
> - components - change over every 3-5 years, including MFG locations,
> (international Fab, moulding compound change (ionic content and alpha
> particles, for example). etc.)
> - material - change vendor location, regulation, industry change,
> consolidation, Merge etc....Fast transition causes loss of expertise,
data,
> OEM, history.
>
> (2) Large volume supply chain v.s. small volume usage
> - JIT practice is carrying out in the material, components, supplying
chain.
> the market distribution is based on more and more on distributors and
> sub-contractors (consolidation, merge, acquisition again).
> - shelf life reduction as result of middle men (distribution layer) up to
> 50% (100% from MFG date, 50% from the distribution date=shipping date).
the
> practice with "minimum quantity" buying make small volume usage and
"repair
> and overhaul" supply difficult and costly.
> - Large package size (super market style) instead of small individual
> package make work life sensitive material difficult to kit to the
> manufacture floor. e.g. one adhesive material used to be 1 lb kit and 12
lb
> minimum buy... usage 1 lb per month with shelf life 1 year.  The new
> notification indicate that material is currently supplied as 12 lb kit
with
> work life of 90 min (moisture sensitive too...It is gaining weight when I
> try to measure it by weight.).  The supplier is not recommended
repackaging
> into small size kit on our location due to possible degradation when
expose
> to moisture...No recommendation for how to handle the material at repeated
> usage environment (12 times per year)...One recommendation: "why not use
> something else?"...(but no "drop-in fit", you need re-qualification!)
> - after market issue... ware house supply after market materials with
> limited known history and cost of testing are high if the test procedure
is
> documented (you are very lucky to get the test procedure).
>
> There are other issues, like interface (someone want to commend on SRAM,
> syn. vs. non-syn?), standard, mixed generation of components (fine pitch
> device=upgrade beside PGA...).design flexibility... etc.etc...
> Some of the cost saving measure done by the supply is transfer to the cost
> of manufacturing, re-design and sustaining.  It is testing the engineering
> force to the extream to find solutions at business "new age" (jump over
the
> hoops.  if you don't believe me, just try to change one of material in a
> defined process/reliability product at final assembly level...).
>
> As for my conclusion:
> The environment of merge, acquisition, consolidation and others is a:
> Marketing, CEO, MBA - "great opportunities"
> Manager, Tech directors - "wonderful Challenges"
>
> me - "Honest to God, Roger, we have problems!" (is any "Roger" out there
> listening?  Is any one feel my pain?).. (it is may be politically
> in-correct.. but it is my true feeling...may be it is because I am not a
> MBA, not even a "MBA to be";-).
> Thanks God! 90 is almost gone...2000 is a new leaf...;-0
>                               jk
>
> At 03:23 PM 9/3/99 -1200, you wrote:
> >Hey Guys,
> >
> >I just want to get your opinions regarding the business trend of merging
> >and acquisition (acquiring of one company by the other company).  What
are
> >the pros and cons, benefits?
> >
> >Any inputs will be highly appreciated, I just need those info on my
> >research as part of my MBA program.
> >
> >Thanks
> >
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