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August 1999

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Subject:
From:
"Carano,Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 31 Aug 1999 09:30:20 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (148 lines)
Marvin,

In the past with conventional DC plating, the results of many DOE's and
practical experience has lead us to rate many factors with respect to their
affect on plating distribution:

From our experience (rating the factors on a scale of 1-10, with 10 having
the most significant weighting)

1.      PWB pattern design                      10
2.      Rack design                             10
3.      cathode current density          8
4.      Anode Cathode/config            7
5.      air agitation/sol. Flow          7
5.      board agitation(through hole) 7
6.      Sol. Composition                         7
7.      Organic addition agents          5
8.      Solution contaminants            3

You can try installing eductors for instead of air agitation. (object is to
get laminar solution flow across the panels)
Pulse plating may be an option. Raise the acid to copper metal ratio to
between 12 to 15 to 1. Cathode cd not to exceed 15ASF. Reduce anode to
cathode area. Try slab anodes instead the nugget type.


Good luck,

Mike

        -----Original Message-----
        From:   Geoff Layhe [SMTP:[log in to unmask]]
        Sent:   Tuesday, August 31, 1999 8:04 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] how to improve plating distribution

        Marvin,
        There are a LOT of factors to look at when you are trying to obtain
and
        maintain good plating distribution. Here's a few quick ones to be
going
        on with.  I'm sure there'll be more.

        Solution agitation, espescially if the filtration uses the same
pump.
        Air agitation
        Board movement
        Anode:cathode area ratio
        Anode;cathode distance
        Acid:copper ratio
        Anode dimensions relative to the board
        Connections
        Cleanliness of dry film developer solution
        Conductivity of direct metalisation if used.
        Pulse plating
        "Baffle plates" between anode & cathode
        Precleaning chemistry

        I guess none of the above will give you a big improvement on their
own,
        but by improving and controlling each of them you should see a good
        overall improvement.
        Depending on your particular set-up I would go for solution
agitation
        first.

        Hope this helps

        Geoff Layhe
        www.lamar-uk.co.uk
        > ----------
        > From:         marvin v. picardal[SMTP:[log in to unmask]]
        > Reply To:     TechNet E-Mail Forum.;marvin v. picardal
        > Sent:         31 August 1999 22:24
        > To:   [log in to unmask]
        > Subject:      [TN] how to improve plating distribution
        >
        > TECHnet'rs,
        > Greetings!!! PCB Geniuses
        >
        > I want to gather suggestions regarding items to be considered to
        > maintain even distribution for copper plating. So far I have
already
        > evaluated the effect of board spacing, organic chemical dosage
        > control, tank design modification. But the result shows only few
        > developments.
        >
        > Other related principles such as that of mass transfer would be of
        > great help.
        >
        > thank you.
        >
        >
        > Marvin
        > Chemical Engineer
        > PWB
        >
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