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August 1999

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Subject:
From:
Nicholas LAI <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 31 Aug 1999 09:25:56 +0800
Content-Type:
text/plain
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text/plain (99 lines)
Can u illustrate the second point..... I cannot catch the meanings.
Thanks for ur help.

Best Regard,
8/31/99




Mark Mazzoli <[log in to unmask]> on 99/08/30 07:06:09 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Mark Mazzoli <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Nicholas LAI/CS/Topsearch)

Subject:  Re: [TN] Nick circuit can't detect.. Problem



Hi Nicholas,
Two ideas as to the "dish down" problem.  One, they could be resin spots
left on after lamination.  They will resist subsequent plating and etching
yet leave the base copper intact after etching.  Or, two, plating pits.
They can (and usually do) span the width of the trace (especially if they're
due to air supersaturation in the copper baths).  I was unable to open your
attached file so these suggestions are based on your description only.

Good luck

Mark Mazzoli
Eng. Mgr.
Circuit Technologies, Inc.
3622 Clearview Pkwy.
Atlanta, GA 30340
770-458-1700
[log in to unmask]
----- Original Message -----
From: Nicholas LAI <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, August 28, 1999 12:32 AM
Subject: [TN] Nick circuit can't detect.. Problem


>
>
> There is some problems I cannot be solve... Hope all of your can help
me...
>
> (1)We found that there is many board can be escape from E-test...
> After micro-section analysis, we found that there is still base copper on
trace
> open location.
> We can said that the problem is dish down ... There is still connected but
the
> resistance is greater than normal one...
>
> What is the cause of this defect?
> Is there any reliable method to detech it?
> Is there any apparatus can detech the nick circuit problem expect AOI.?
>
> (Embedded image moved to file: pic22705.pcx)
>
> Best Regard,
> nicholas lai
>
>
>

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