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August 1999

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Date:
Sat, 28 Aug 1999 10:44:14 -0700
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Outgassing through plated holes, yes. Delamination of that size, no. Poor
design, material selection, and process management, yes

Earl Moon
----- Original Message -----
From: Gerry Savard <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, August 28, 1999 8:12 AM
Subject: Re: [TN] Blisters or Delamination after Wave...


> Sounds like moisture entrapment to me.  A little moisture, some heat....
> steam... and pop!!  What temperature and how long do you bake the boards?
> Were they soldered shortly after bake?
>
> Gerry S.
>
>
>
> ----- Original Message -----
> From: Stephen R. Gregory <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Saturday, August 28, 1999 10:37 AM
> Subject: [TN] Blisters or Delamination after Wave...
>
>
> > Hi ya'll!
> >
> > Well, I'm in onna Saturday...(Months end, you know how that goes!). Just
> > finished waving a small lot of boards (9 assemblies) and 5 of them came
> off
> > the wave with these dime to quarter-sized delaminated blisters, maybe
3-4
> of
> > them on each board, and the other 4 boards looked fine! What would cause
> > that? Entrapped moisture? The boards were supposedly baked before wave
(At
> > least the traveler said they were). Any ideas?
> >
> > -Steve Gregory-
> >
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