This one helps ; would any of fab fellows elaborate on "standard" impurities
levels in NiAu process please ?
Being copper, phosphorus ; etc. , just to establish realistic expectations ?
thanks(+Roger)ahead paul
-----Original Message-----
From: Roger Massey-G14195 [mailto:[log in to unmask]]
Sent: Friday, 27 August 1999 23:28
To: [log in to unmask]
Subject: Re: [TN] Nickel plating contaminants ; cracking propagati
Paul,
If asked, I tend to recommend 4-6uM of Ni over Cu and it works ok
providing the layer starts clean and relatively pure. As to the Au,
0.3uM seems fine to me, it should be more or less continuous, and will
give a good prtection against most things (85/85 may be different
though!!) seen 0.03uM awork before!!
You can counter quality with quantity providing the quantity has
quality, if the Ni contains 0.5%Cu, it doesnt matter how thick it is,
its going to diffuse through and form the Cu-Sn intermetallics with
solder.
I think you need to track down where the Cu is coming from, and
analyse the Ni layer real carefull before and after reflow. (try auger
or XPS etc as SEM may be a bit unsubtle for small particle detection)
Roger
Motorola AIEG
______________________________ Reply Separator
_________________________________
Subject: Re: [TN] Nickel plating contaminants ; cracking propagations
Author: "TechNet E-Mail Forum." <[log in to unmask]> at #email
Date: 27/08/99 08:33
The Ni "looks" fine Mike ; it's the boulders looking that way .
But considering what Roger says, the Ni won't be as solid as it looks,
you may be onto something .
That brings me to next round of this saga :
On Au some of the fabs really excel themselves , going to less than
0.3um(metric)of Au .
Should I worry about porosity of gold and NiO formation in storage ?
Next one ; stemming from this title ; what would be the bottom "safe" line
on Ni ;
5um, 10um ??? = can we counter the quality with quantity ?
thanks paul
-----Original Message-----
From: Carano,Michael [mailto:[log in to unmask]]
Sent: Thursday, 26 August 1999 23:11
To: [log in to unmask]
Subject: Re: [TN] Nickel plating contaminants ; cracking propagations ?
Paul,
Is what you are seeing looks like a mud cracked appearance in the nickel?
-----Original Message-----
From: Paul Klasek [SMTP:[log in to unmask]]
Sent: Wednesday, August 25, 1999 7:51 PM
To: [log in to unmask]
Subject: [TN] Nickel plating contaminants ; cracking
propagations ?
This must be a problem season :
after flakes, cabbages and roses , I have this copper "boulders"
alloy
problem :
On our routine microsectioning of (4umNi + 0.3umAu; 63/37) joints we
discovered we have rather interesting phenomenon :
After the obvious dissolution of gold ; there are sitting on top of
Nickel
(admittedly bit thin ; still , continuous) microcracked boulders
(about same
dia as the Ni layer) .
when we zoomed scan on them ; we found they're CuSn alloy ! Looks
like a
smallpoxed nickel face .
Now our regular profiling 's telling us we're nowhere near this
alloying
scenarios ;
and we ponder about the cracking propagations ; the Q is :
Where are this aliens coming from ?
Contaminants of tubs from some previous process ?
Smudged sample polish ?
Appears only on one specific fab supply .
Paul Klasek
http://www,resmed,com
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