Matthew
It is possible to do both sides SMT using the same carrier, I've seen it
done on a board in a double sided line (board flipper midway).
To add selective soldering may be a bit more of a challenge, by definition
you are looking to shield something from the solder wave that was put on
earlier (e.g. in SMT).  So you would have to have a clip on addition - which
would increase your risk of fixture failure.

I'd go with two fixtures.

have a good weekend!

Graham Collins
Process Engineer,
Litton Systems Canada, Atlantic Facility
(902) 873-2000 ext 6215

-----Original Message-----
From: Matthew Park [mailto:[log in to unmask]]
Sent: Friday, August 27, 1999 1:02 PM
To: [log in to unmask]
Subject: [TN] continuous assembly flow for double SMT/TH


Is it feasible to have one type of board carriers to take boards thru 1)
glue curing process for first side and 2)invert carriers with boards, and
3)reflowing second side, and 4) do manual stuffing of th components and 5)
take them thru selective wave soldering process?

I am trying to create a continuous assembly process where SMT components for
bottom side is cured and for top side is reflowed, and TH components are
wave soldered selectively by using one type of board carriers without
operators handling boards.

Is any assembly company doing this, assembling both sides of SMT and doing
selective wave soldering for TH in a continuous process?
My thought suggests that this is not possible. And this continuous process
with one board carrier type only works with SMT and TH components on one
side.

appreciate your technical inputs



Matthew S. Park
Sr. Process Engineer
Phoenix International Corp.
701-277-6434
[log in to unmask]

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