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August 1999

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Subject:
From:
Bill Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Aug 1999 09:36:24 -0700
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Try hydrogen embrittlement as a root cause. What's the oxygen content of
your copper?


Bill Davis, Ph.D.

Principal & Vice President/IP Managers

[log in to unmask] <mailto:[log in to unmask]>



-----Original Message-----
From: Joan M.Slade [mailto:[log in to unmask]]
Sent: Saturday, July 31, 1999 7:13 AM
To: [log in to unmask]
Subject: [TN] copper cracking



I have a question in regards to copper plating cracking on Teflon(tm)
materials.
The problem is only seen after ni / au plating. If the boards are flexed,
the underlying copper cracks. What would cause this ?
We are baking the boards and removing humidity issues.

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