Hi, Rudy:
As the new comer from the electro-coating equipments supplier
to be the PCB/LEAD FRAMES/SUS ETCHING's maker,
We use both EDPR (Electro-depositiom Photo Resist) and
Dry Film to make the fine lines. The trouble is the adhesion
of dry film and EDPR being poor to SUS(Stainless Steel)
adhering.
Related to your dry film soldermask adhesion, would you please
give some idea to improve adhesion of DF/EDPR to SUS.
Thanks a lot.
Chung J. Lee
-----原始郵件-----
寄件者: Rudy Sedlak <[log in to unmask]>
收件者: [log in to unmask] <[log in to unmask]>
日期: 1999年8月26日 AM 06:33
主旨: Re: [TN] Dry Film Soldermask Adhesion..
>Steve:
>
>You finally asked something that I can answer! Thanks!
>
>The problem of adhesion of Dryfilm soldermask to bare Copper is a legend,
and
>it is NOT your cleaner, almost certainly. Dryfilm soldermask does not
adhere
>to Copper well. H-P (remember them, they used to make PCB's) had an
>especially, ahh, "interesting" test for soldermask adhesion, where they
>floated the board on molten solder for 1250 hours, or some such, and no
sort
>of cleaning could get them through the test....and they further said that
>essentially all cleaning gave the same results, whether chemical, or
>mechanical abraision.
>
>However, oxide made the soldermask stick so strongly that you had to
destroy
>the mask to get it off.....
>
>So, we formulated an oxide chemistry for them that they sprayed on, that
was
>SO light you could not see it. We got to calling it the "Emporer's Oxide",
>as only the faithful could see it!!!!
>
>They had some non-believers (at H-P) that at one point, removed panels from
>the oxide line, and put soldermask on them to see if they could tell a
>difference between panels that had been run through the oxide line, or not.
>THERE WAS, BIG TIME.
>
>This is a bit extreme, to consider oxide under soldermask, but it do work,
>and is the best possible bond enhancer.
>
>Hope this helps, in some way.
>
>Best,
>
>Rudy Sedlak
>RD Chemical Company
>
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