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August 1999

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Aug 1999 00:01:36 EDT
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Hi Eric,
Get a copy of IPC-SM-782.
But why are you considering LCCs (leadless ceramic chip carriers)? Are you
mounting them on ceramic? If you are using FR-4 or any other polymer-based
substrates you can forget about reliabilty in any environment other then a
really benign one, such as sub-ocean cable repeaters. You could of course put
solder columns on the component.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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