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August 1999

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From:
Enter your name here <[log in to unmask]>
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TechNet E-Mail Forum.
Date:
Wed, 25 Aug 1999 22:06:11 -0700
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One of the reasons, years ago, we all attempted to run as fast as possible
away from DFSM is it doesn't adhere well to much of anything.

Earl Moon
----- Original Message -----
From: Stephen R. Gregory <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 25, 1999 2:27 PM
Subject: [TN] Dry Film Soldermask Adhesion..


> Hi Ya'll!
>
> I've had one of our buyers come to me with a problem that we have with one
of
> the fabs we buy.
> I'm no expert on fabs by a long shot, but I told him know where to ask (am
I
> kissing-up enough? Hehehe...)
>
> Problem is with a fab (GFG laminate) that our customer is specifying dry
> film...they want to ensure the via's
> are tented. There isn't a brand specified, but they do want the fab masked
in
> accordance with IPC-SM-840 Class-3
> Type B dry film. Our fab vendor has chosen to use a Dynachem dry film. The
> problem we're having is that the mask is
> flaking from the bare copper. The fab vendor is suggesting that our
cleaning
> chemistry may be causing the problem.
> We're using Aquanox XJN in a MCS-1000 Electrovert cleaner. The wash
> temperature is 140 F., and my rinse is 120 F.
>
> Know what might be causing this? Do you recommend any other brand dry
film?
>
> Thanks!
>
> -Steve Gregory-
>
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