All,

Here's a theoretical question...What percentage of phosphorous can be plated
up with nickel in the electroless nickel immersion gold process?  I have a
vendor telling me its impossible to have 12% phosphorous in the bulk nickel
plating.

More questions...At what point do you see problems with solderability of the
nickel?  Do repetitive reflows exaggerate the problem by locally depleting
the nickel at the surface of the board (by transformation into Intermetallic
compounds)?

Thanks
Scott

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Scott M. Severson
QA/FA Lab Manager                                            "Space and Time
                                                              are not
conditions in which we live,
Benchmark Electronics Inc.                         but modes in which we
think."
4155 Theurer Blvd.
Winona, MN 55987
---Albert Einstein
(507)452-8932
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