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August 1999

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Subject:
Re: Advice on solder pad design
From:
Kenneth Kirby <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Aug 1999 12:25:44 -0500
Content-Type:
multipart/mixed
Parts/Attachments:
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You can get the information you need from SMT Plus
"http://www.smtplus.com/"

Ken Kirby




 (Embedded
 image moved   Eric Christison <[log in to unmask]>
 to file:      08/25/99 11:08 AM
 pic27492.pcx)




To:   [log in to unmask]
cc:    (bcc: Kenneth Kirby/ElectrovertUS/Cookson)
Subject:  [TN] Advice on solder pad design




Can anyone direct me to a set of design rules for determining the size of
solder pads for LCC packages.

Thanks,



Eric Christison

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