Jim,

we do fabricate boards with 4 mil buried and blind microvias and 4 mil
lines/spaces (down to 2 mil is possible).

In a typical DYCOstrate 4 layers build-up we have blind vias going from
layer 1 to 2, through vias between layers 2 and 3, and blind vias from 4 to
3. More than 4 microvia layers are also possible.
Each layer is 2 mil thick (polyimide).

You can have a look at our web page for design information, other build-ups,
and examples of applications.

Please contact me direct for more information.

Best regards
Mike

_____________________________________________________________________
Dr. Michele B. Stampanoni (Mike)       Phone:        +41  1 306 20 30
Manager Marketing & Sales              Fax:          +41  1 306 36 40
                                       Mobile:       +41 79 401 17 15
http://www.dyconex.com                 E-mail: [log in to unmask]

DYCONEX Ltd.                           Unterwerkstrasse 3-5
                                       CH-8052 ZURICH
Advanced Circuit Technology            Switzerland
_____________________________________________________________________


----------
>From: Jim Kittel <[log in to unmask]>
>To: [log in to unmask]
>Subject: [TN] Micro VIA's
>Date: Mon, 23. Aug 1999 23:49
>

> Fellow TechNetters,
>
> We are are moving into the assembly/design of circuit card assemblies using
> micro via technology and I need a lead on some PWB vendors that can
> fabricate boards with buried or blind micro vias.  These designs will
> require vias in the 0.004 to 0.008 inch diameter range with 0.004 inch trace
> widths.  I would like to find a supplier that can do the entire process in
> house.  The finish will be nickle/immersion gold, typically FR-4 or
> polyimide and we are talking small order sizes.
>
> Any ideas on who to contact?
>
> Jim Kittel
>
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