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August 1999

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Subject:
From:
Paul Brown <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Aug 1999 22:22:36 +0100
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PEG type products are often used in older types of HASL and reflow fluxes
PEG type products are infamous for their poor rinsability

[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bill Davis
Sent: 20 August 1999 21:14
To: [log in to unmask]
Subject: [TN] PEG?

I am experiencing a contaminant on the gold contact fingers on our boards
after assembly. We have identified it as polyethylene glycol laureate, a
surfactant. We do not use use tape or boots on our fingers and our process
is a no clean process. Our incoming inspection doesn't see it there when the
bare fabs arrive, but we see it there after assembly. We are more than a
lttle mystified as to the source of this. We do use OSP on the boards (Entek
160), but this doesn't appear to be the source either.

I curious if such sufactants would be used during the manufacturing
processes of the bare fabs and could be leaching out during reflow?

 Bill Davis, Ph.D.
 Senior Scientist
[log in to unmask]

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