If you're getting measling and/or delamination, as received, your supplier
has serious problems. This is not the relamination process used for simple
MLB's, as you already know.

If it is observed during or after assembly processing, moisture could be an
issue as polyimide is much more hygroscopic that most epoxy resin systems.
However, continuous or excessive thermal exposure causes problems with the
stuff as well. Check Tg using TMA or DSC and ask you supplier press cycles
and targeted cure as Tg.

Earl Moon
----- Original Message -----
From: Louis, Edwin @ CSE <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, August 19, 1999 7:57 AM
Subject: [TN] Baking Moisture Out of Polyimide PWBs


> Is there anyone out there who has experience with measling ,delamination
> and water bake-out of Polyimide PWBs; particularly
> 8 to  16 layers. I would like to have some input on baking processes at
> atmospheric pressure.
>
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