Exactly,

Pits and dents, many years ago, and still are of major concern. Foil
thickness relative to other anomalies are of great concern. This issue has
been around forever and keeps cropping up placing more pressure on the
"prime" source.

Earl Moon
----- Original Message -----
From: TPE Engineering TechNet <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 18, 1999 11:19 AM
Subject: Re: [TN] Board Layout for AOI and LPI -Reply


> I agree with Patricia whole heartedly. However, due to the
> complexity of todays product, with lines and spaces going
> down to 3/3 and less, it may also be time to take a look at
> the requirements placed on our laminate and other material
> suppliers. Small dents and epoxy spots (acceptable to IPC
> requirements) on copper clad laminate which may not have
> been an issue in the past on 10 mil lines and spaces, are
> definately an issue with todays 3 mil and less technologies.
>
> Ron Hayashi
> 1-858-695-2222
> [log in to unmask]
>
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