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August 1999

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Subject:
Re: 603s
From:
"Valladares, Hector A (FL51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Aug 1999 10:10:51 -0400
Content-Type:
text/plain
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text/plain (59 lines) 
New  IPC-7095 covers this topic (Design and Assembly process implementation
for BGA's). You can down load it from their web site. It is in final draft
at present time.
Good luck

Hector Valladares
Honeywell -SASSO
Production Staff Engineer
727.539.3683 voice
727.539.4469 Fax
[log in to unmask]



-----Original Message-----
From: Jason Smith [mailto:[log in to unmask]]
Sent: Tuesday, August 17, 1999 2:49 PM
To: [log in to unmask]
Subject: Re: [TN] 603s


Two questions:
Does industry see a major problem with wave soldering 603 packages?  Any
special
considerations when running?

What is industry's void acceptance and registration criteria for BGAs?
Seems
like noone is willing to share.

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