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August 1999

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Subject:
Re: 603s
From:
Enter your name here <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Aug 1999 16:53:44 -0700
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text/plain (54 lines) 
No problems with 603's if you can get the glue right, when needed. Seems
many dispensers can't do it but stencils can.

The void acceptance issue is almost a non issue. BGA's are to damn easy, but
major voiding is to be avoided, but seldom happens to the extent it affects
reliability.

Earl Moon
----- Original Message -----
From: Jason Smith <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 17, 1999 11:49 AM
Subject: Re: [TN] 603s


> Two questions:
> Does industry see a major problem with wave soldering 603 packages?  Any
special
> considerations when running?
>
> What is industry's void acceptance and registration criteria for BGAs?
Seems
> like noone is willing to share.
>
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