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August 1999

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Aug 1999 14:42:34 -0500
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Hi Scott! Do you know the alloy designation of the copper/nickel material?
That information would be helpful. Nickel oxide is pretty tough stuff and
it takes an active flux to remove the nickel oxide for soldering. Your
solderability problems can be most likely traced to this and possibly
copper/tin intermetallic issues if your solder coating has been applied
directly to the copper/nickel alloy. Have you ran a solderability test per
ANSIJ-STD-002A?

Dave Hillman
Rockwell Collins
[log in to unmask]




"Severson, Scott M." <[log in to unmask]> on 08/17/99 10:50:08 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Severson, Scott M." <[log in to unmask]>

To:   [log in to unmask]
cc:
Subject:  [TN] Cu/Ni Alloy?




 Hi All,

We have some SMT LED's that were exhibiting solderability problems and
investigation with the SEM/EDS revealed that the base metal is composed of
a
copper alloy that contains about 10% nickel.  Does anybody have any
experience with this material?  Do they require higher reflow temperatures
similar to Alloy 42?

Any information would be appreciated.

Thanks
Scott

***************************************************************************
*
*************************
Scott M. Severson
QA/FA Lab Manager                                            "Space and
Time
                                                              are not
conditions in which we live,
Benchmark Electronics Inc.                         but modes in which we
think."
4155 Theurer Blvd.
Winona, MN 55987
---Albert Einstein
(507)452-8932

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