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August 1999

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Subject:
From:
Chuck Brummer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Aug 1999 08:01:36 -0700
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text/plain (66 lines)
Anne,

Nice to see your name,  E-mail for nice to hear from you again.

Ask your material supplier about the prepreg construction of your core.  If they are
using a heavy glass ask them if they have alternate constructions with lighter weight
glass at the surface?  Laminators usually will have other constructions for the same
thickness core but the heavy glass is cheaper and easier to produce.  You may have to
pay, sorry, extra for the lighter weight construction.  You may not have the same
dimensional stability either.

Good luck and call me if you want to talk more about it.

Chuck Brummer
Acuson
818.734.4930

Anne Ledger wrote:

> Good Morning Technetters,
>
> I have a question for board fabbers.  Problem:  We are experiencing
> weave texture on our innerlayer material.  I have spoken to the
> manufacturer who states that weave does shift in the "pour" of the
> material (when the resin is added) and that there is no specification
> that controls the depth requirement of the weave.  The topography is
> visual prior to lam/image.  The condition is causing our resist to lift
> slightly and allows an etch stain on the double treat foil that so far
> we can not remove.  Question:  Is this a typical condition of innerlayer
> material (other manufacturers)?  Is it double treat foil only?  Is there
> a way to remove this type of etch stain?  What is the acceptablity of
> stain on inner layer foil?  I can't find any reference info in IPC.
>
> Any and all input would be appreciated.
>
> Anne Ledger
> EMDS, Inc.
>
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