TECHNET Archives

August 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Anne Ledger <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 17 Aug 1999 08:45:56 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
Good Morning Technetters,

I have a question for board fabbers.  Problem:  We are experiencing
weave texture on our innerlayer material.  I have spoken to the
manufacturer who states that weave does shift in the "pour" of the
material (when the resin is added) and that there is no specification
that controls the depth requirement of the weave.  The topography is
visual prior to lam/image.  The condition is causing our resist to lift
slightly and allows an etch stain on the double treat foil that so far
we can not remove.  Question:  Is this a typical condition of innerlayer
material (other manufacturers)?  Is it double treat foil only?  Is there
a way to remove this type of etch stain?  What is the acceptablity of
stain on inner layer foil?  I can't find any reference info in IPC.

Any and all input would be appreciated.

Anne Ledger
EMDS, Inc.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2