Hello,

I'm wondering if anyone can give me any information on the design of
conduction cooled boards for use in an airborne military environment?
I'm intending to use VME size boards with a copper-invar-copper constraining
core, and an aluminum stiffening frame with wedge-locks.
Is there any problem with using FR4 or FR5 material, or should I be looking at
something like Polyimide or BT/Epoxy?
Is it commonplace to use SMT devices (QFP)?
Also, there are few manufacturers here with any experience producing such
boards, so any pointers to possible manufacturers would also be appreciated.

thanks,
Phil.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################