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August 1999

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Subject:
From:
Jorge Engenharia <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Aug 1999 14:52:43 -0400
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Uday
   I saw a improvement when I changed from a No Clean flux 1.8 to 2 % solids
to a Rosin based flux with 4 % solids, the number of bridging in paralel
conectors decreased, the lenght of the leads are important also. A good DFM
practice is put this conector in perpendicular direction with the wave (
unfortunally due to many reasons this is not always followed ... ). Once we
have to "live'' with 100% bridging due to bad design.
  I saw at soltec site one device that makes a kind of localized touch up
just after the lambda wave ( atached with the solder pot ) to remove
bridging from components, I don't know if works well but it is another
solution ... ( unfortunally my internet is down and I don't have the site
address )

Jorge Dourado de Santana
Maintenance / Process Engr
Microtec - Brazil



> To:   [log in to unmask]
> cc:    (bcc: Shean Dalton/ElectrovertUS/Cookson)
> Subject:  [TN] 50-mil pitch two row connectors
>
>
>
>
> Hello All
>
> We have 50-mil pitch two row TH connectors on some of our boards. The
> direction of flow in wave is parallel to the row of pins. This part always
> bridges on the last pins as there is lot of drag at the end. We also tried
> to add a thieving pad at the end of the last pin in the direction of flow
> to help, but the test results didn't help much. (only 50% yield).
>
> Does anyone has experience with this case? Any help is appreciated
>
> Thanks
> Uday
>
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>  << File: pic05092.pcx >>

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