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August 1999

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 3 Aug 1999 14:26:11 EDT
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Hey ya'll!

Well, it's cooled down to a balmy 90-degrees here, and boy are my sweat
glands happy!...hehehe

But email ain't to talk about my how much I perspire, but about changing
cultures. One of my "opportunities" as presented to me here is figuring out
how to reduce costs (aren't we all trying to do that?).

One of the things that I've noticed since I've been here, is that there is
that everything is looked at through MIL-SPEC shaded glasses...and I've found
that boards we were building under IPC 610 class-II standards were being
touched-up un-neccessarily. Things that are maybe only a process indicator,
but acceptable, are being reworked. For one example, dull solder joints that
were caused because an active OA flux was left on longer than it should have
been before cleaning has made the joints look dull. QA won't accept the board
until all the solder joints are sparkling. I'll fix the problem about the
operators leaving the flux on too long before washing the board, but you
still don't need to touch every joint up! But I sure couldn't convince QA of
that...and so on it goes.

Part of the history here is that they've always done MIL-SPEC work here, and
a lot of that work isn't as plentiful as it once was. One reason I fully
believe is because of the costs associated with building product to that
level of quality. At my last company we built product that was going on the
space shuttle, but yet it only needed to meet 610 Class-II standards. It
wasn't any guidance stuff or anything like that, but even NASA is relaxing
things a bit.

Class-II product is something new here, and I think I'm gonna have my hands
full trying to get people out of that MIL-SPEC culture...it'll be hard to
make any money doing things that way with the difference in the margins
between MIL-SPEC and commercial class-II product..

Any suggestions anybody?

Thanks ya'll!

-Steve Gregory-

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