Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 13 Aug 1999 15:44:00 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Greetings,
Is there anyone out there that has come across mathematical modeling of fluid dynamics in a standard vertical electroless Cu process. The parameters that I am interested in optimizing are:
Panel Spacing
Panel Angle (vertical)
Panel Angle (horizontal)
Agitation Direction
Agitation Speed
Agitation Stroke Length
Vibration Rate
I need to include in the variable set, the aspect ratio as well as the absolute hole size and panel thickness. We are of course most interested looking at this in respect to solution delivery to the hole walls.
This message/request probably seems a bit vague, for that I apologize. If you have any feedback it would be greatly appreciated.
Regards,
Joe Aronson
Wet Process Engineer
JMSPI
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|