Lots of solutions, much can be bought over desk. Try Fujitsu,
Thomas&Betts, Robinson Nugent, Winchester, Textool, there are "hundreds"
of companies. Get a 1998 directory edition of EPP (Electronic
Packaging&Production) and you will find the adresses. Textool is our
favorite. If you are in the multiGHz range Winchester and HP are good.
I'm afraid you will be drowned by more tips./Ingemar


> Hi everyone,
>
> We are currently designing an MCM-C and was wandering how to do the
testing
> of the module after it has been assembled. All your kind assistance
would
> be highly appreciated as this is the first time that we are designing
this
> kind of module.
>
> Several ideas have been thrown up by our team but don't know if they
are
> feasible. One such idea is building test boards on organic substrates,
then
> soldering the module for test and desoldering it after test. Others
include
> getting someone to fabricate a test socket (but don't know who does
this
> kind of thing). Another problem is how to probe the parts during
> troubleshooting.
>
> Looking forward to expert advice from you!
>
> Rgds - Kuan
> Kuan Kuan Ng
> DSO National Laboratories
> 20 Science Park Drive
> Singapore 118230
> Voice: (65) 772-7126
> Fax: (65) 775-9011
> E-mail: [log in to unmask]
>
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