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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 13 Aug 1999 06:30:03 -0600 |
Content-Type: | text/plain |
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Hi Bob,
Glad to hear you are not corresponding from the 'other side'. I was
reluctant to reply on jumpering BGA's because I had hoped some one had a
better way, like the application of a liquid, conductive trace. Maybe not.
What I did was to actually use 30 Ga. magnet wire and route the jumper
between solder balls. I performed this under a microscope and epoxy tacked
the jumper at various places, taking care to keep the epoxy from the solder
balls. The BGA was a 1.27 mm pitch, 313 pin PBGA. After a few tries, it
took me about 5 minutes to complete one jumper. I have no idea what this
would do to the reliability of the assembly, never did any thermal stress
testing. Fortunately I have never had to actually use this trick. This
would obviously not work with the 0.8mm and 0.5mm pitches now being used.
Jim Kittel
> -----Original Message-----
> From: Bob Vanech [SMTP:[log in to unmask]]
> Sent: Friday, August 13, 1999 5:04 AM
> To: [log in to unmask]
> Subject: [TN] Outsourcing of Conformal Coating
>
> Hi all...
> Happy, happy Friday..I'm above ground and typing..
> that's good! I still have not had any takers on the
> incorporation of jumpers as related to BGAs. Maybe
> next week?? ;->
> However, I have a new concern. We are looking to
> out-source the conformal coating of our assembilies on
> our new product. We have two part numbers in low
> quantity, prototypes at this time, that need to be
> coated. However, our assembler hasn't done this before
> and doesn't what to start. His other customers have
> never required c/c on product. So, is there someone
> out there in TN land that has a lead?? Thanks in
> advance and have a great weekend.
>
> Regards,
> Bob
> Bob Vanech
> BVAN Enterprise
>
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