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August 1999

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Subject:
From:
Mark Mazzoli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Aug 1999 06:56:14 -0400
Content-Type:
text/plain
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text/plain (90 lines)
Hi Torben,

Sure, different resists offer various results when plating Ni/Au.  Many are
sold just for the Ni/Au plating process and some are sold as "all-purpose",
being equally suited for copper plating and even etch resist.  There could
be other factors leading to the resist failure, such as gold concentration
(most baths run best at 1.0 oz/gal) or a cleaning/micro-etch
incompatibility.  Write me off-line and I'll see if I can help.  Send me
details of which resist you're using now and your vendors gold parameters.

Mark Mazzoli
Engineering Manager
Circuit Technologies
3622 Clearview Parkway
Atlanta, GA 30340
770-458-1700
[log in to unmask]



----- Original Message -----
From: TOE /Torben Østeraa <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, August 13, 1999 5:45 AM
Subject: [TN] Gold plating resist


Dear collegues,

When producing strip-line boards with Nickle/Hard-gold as etch-resist, it is
a well
known problem that the hydrogen generation in the plating baths can
sometimes
cause lifting of the photoresist. This results in plating of nickle and/or
gold under
the resist.
Some tricks are known ( or at least told )  to minimize the problem, e,g,
baking or
UV bumping prior plating and reducing current densities.
Still, I find the proces far to unpredictable and  am thefore seeking advise
on this problem.
Does brand of photoresist make a difference?. Several plating houses have
had
best experiences with a product from german 'Hoechst', but this is not
available anymore.

We are using sub-contractors for the plating proces, but apply the plating
resist
ourselves.

Sorry if this problem has been on this forum resently, but perhaps new
information
is available today?....

regards

Torben Østeraa
tech. mgr.
Printca AS
Denmark

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