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August 1999

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Subject:
From:
TOE /Torben Østeraa <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Aug 1999 11:45:01 +0200
Content-Type:
text/plain
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text/plain (48 lines)
Dear collegues, 

When producing strip-line boards with Nickle/Hard-gold as etch-resist, it is
a well
known problem that the hydrogen generation in the plating baths can
sometimes
cause lifting of the photoresist. This results in plating of nickle and/or
gold under
the resist.
Some tricks are known ( or at least told )  to minimize the problem, e,g,
baking or
UV bumping prior plating and reducing current densities.
Still, I find the proces far to unpredictable and  am thefore seeking advise
on this problem. 
Does brand of photoresist make a difference?. Several plating houses have
had
best experiences with a product from german 'Hoechst', but this is not
available anymore.

We are using sub-contractors for the plating proces, but apply the plating
resist
ourselves. 

Sorry if this problem has been on this forum resently, but perhaps new
information
is available today?....

regards

Torben Østeraa
tech. mgr.
Printca AS
Denmark

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