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August 1999

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Subject:
From:
Kuan Kuan Ng <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Aug 1999 17:24:38 +0800
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Hi everyone,

We are currently designing an MCM-C and was wandering how to do the testing
of the module after it has been assembled. All your kind assistance would
be highly appreciated as this is the first time that we are designing this
kind of module.

Several ideas have been thrown up by our team but don't know if they are
feasible. One such idea is building test boards on organic substrates, then
soldering the module for test and desoldering it after test. Others include
getting someone to fabricate a test socket (but don't know who does this
kind of thing). Another problem is how to probe the parts during
troubleshooting.

Looking forward to expert advice from you!

Rgds - Kuan
Kuan Kuan Ng
DSO National Laboratories
20 Science Park Drive
Singapore 118230
Voice: (65) 772-7126
Fax: (65) 775-9011
E-mail: [log in to unmask]

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