Hi all,

Our production is high-mix low volume with double-sided boards with a wide
range of component types.

We bought a flying probe tester recently and we are know thinking of replacing
the visual inspection by something automatic.

With the coming of BGA components, we know we will need X-ray inspection.
We are hesitating between a "manual" machine and automated X-ray inspection
which would be used for the whole board.

Has anyone made the step to an automated X-ray inspection ?
Has anyone bought this type of equipment in Europe ?
What do you think about the results ?
Is the solder defect coverage OK ?
How long does it takes to setup the machine for a new production ?

Thanks,

Vincent Bada
Process Engineer
Alcatel Etca
Belgium

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