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August 1999

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Subject:
From:
Glenn Pelkey <[log in to unmask]>
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Date:
Wed, 11 Aug 1999 08:07:30 PDT
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Lucas,

Most of the burn-in done today is based on contractual agreements rather than
the actual need to perform burn-in.  I personally believe there is a place for
burn-in or other device screens depending on the product design, development
cycle, and application.  I'm also a firm believer in using the information
that comes from the screen and eliminating or modifying it as needed.  It all
gets back to minimizing overall cost.

As for why 125 C instead of some other temperature, the military specs are the
driving force.  But, another reason is based on the construction.  The
material set usually allows for temperatures in that range without causing
unrelated failures (i.e. failures that would not occur under normal use).  The
Arrhenius acceleration equation holds for these "Early Life Failures" and the
higher the temperature, the shorter the time.  And, we all know how important
it is to minimize the manufacturing time.

Glenn

Lucas Liu <[log in to unmask]> Wrote:
|
| Hi,
|
| Does anybody know what is hybrid testing in terms of burn-in and why
| most devices especially processor chips have to go for oven burn-in at
| temperatures of 120 - 130 degrees ?
|
| Rgds.
| Lucas

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