Lucas,
 you may look in MIL-H-38534 chapter 4.5 Screening. Burn-in is included.
With endless patience you may snail yourself through that kind of
document made by 40s. Certainly a healthy pack of paper, but after I
have seen Starwars, I fall asleep seconds after opening MIL-STDs (sorry,
a failure somewhere in my synapsis system). Now, from our point of view,
there is a risk to damage the 'hybrids' instead of making them safer, so
we have essentially skipped the burn-in for many products. And our
customers agree. Instead the quality and safety should be built-in by
means of a good design and a good manufacturing process. There are
papers describing how dangerous electronic's life are before they leave
the factory, most failures occur during manufacturing, burn-in can be
such a failure source. Furthermore, the test is costly. Of that reason
we looked at Hewlett Packard's one-minut-burn-in called BAMBI, but at
that time they were not willing to share with us. Don't know what became
of it. Just some random ideas. Good Luck.

Regards/Ingemar


> Hi,
>
> Does anybody know what is hybrid testing in terms of burn-in and why
> most devices especially processor chips have to go for oven burn-in at
> temperatures of 120 - 130 degrees ?
>
> Rgds.
> Lucas
>
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