TECHnet'rs,
Greetings!!! PCB Geniuses
I want to gather suggestions regarding items to be considered to maintain even distribution for copper plating. So far I have already evaluated the effect of board spacing, organic chemical dosage control, tank design modification. But the result shows only few developments.
Other related principles such as that of mass transfer would be of great help.
thank you.
Marvin
Chemical Engineer
PWB
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