Hi all,

I'm interested in finding out how a temperature profile is developed for a
new PCB design that contains BGA components. Are bare boards along with
dummy BGAs required for developing the profile prior to the actual build or
do you jump right into building an actual board and then test it to prove
out the profile that was used? Are the thermocouples used for monitoring the
temperature placed above the components or are they placed between the board
and BGA by drilling a hole through the board to get under the BGA with the
thermocouple? I'm thinking of adding an unplated hole under each BGA that
may be in a design, so that a thermocouple could be used to monitor the
temperature for developing a temperature profile. Does this sound like a
good idea or is this already a common practice for designs that use BGAs?

Regards,

Bob Walker
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