To interested parties

The use of lead-free solders that have higher temperatures will derate the
MSD levels that are currently applied to the packages by JEDEC using
S-STD-020A.  The derating will mean that the devices will drop by 1 or two
levels. (a level 3 will now become a level 4 or 5)  Many level 1 devices
will  become moisture sensitive at these higher temperature.
We also assume that the higher reflow will have no effect on the internal
package connections or performance.
IC manufacturers recently complained about the inclusion of the dual
temperature range used by J-STD-020A, this will just make their screams even
louder.
If one wishes to avoid all MSD problems prior to assembly then one could
bake all components before SMT mounting. (Not really practical)
Dave Nicol
(609) 639-2511
fax (609) 639-2851
[log in to unmask]

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