Am suffering intermittent poor solderability of ENG. Chemistry is Atotech and gold is
followed by dragout, tapwater rinse and hot DI rinse of 25 micromhos max.Acid cleaning
sometimes improves it but not always.Gold is limited to 5MTO'S. Are some golds better than
others or does the answer lie in the rinsing? All over ENG boards are OK, boards
soldermasked BEFORE gold seem to be worse.
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