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Date: | Fri, 27 Aug 1999 08:33:00 +1000 |
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The Ni "looks" fine Mike ; it's the boulders looking that way .
But considering what Roger says, the Ni won't be as solid as it looks,
you may be onto something .
That brings me to next round of this saga :
On Au some of the fabs really excel themselves , going to less than
0.3um(metric)of Au .
Should I worry about porosity of gold and NiO formation in storage ?
Next one ; stemming from this title ; what would be the bottom "safe" line
on Ni ;
5um, 10um ??? = can we counter the quality with quantity ?
thanks paul
-----Original Message-----
From: Carano,Michael [mailto:[log in to unmask]]
Sent: Thursday, 26 August 1999 23:11
To: [log in to unmask]
Subject: Re: [TN] Nickel plating contaminants ; cracking propagations ?
Paul,
Is what you are seeing looks like a mud cracked appearance in the nickel?
-----Original Message-----
From: Paul Klasek [SMTP:[log in to unmask]]
Sent: Wednesday, August 25, 1999 7:51 PM
To: [log in to unmask]
Subject: [TN] Nickel plating contaminants ; cracking
propagations ?
This must be a problem season :
after flakes, cabbages and roses , I have this copper "boulders"
alloy
problem :
On our routine microsectioning of (4umNi + 0.3umAu; 63/37) joints we
discovered we have rather interesting phenomenon :
After the obvious dissolution of gold ; there are sitting on top of
Nickel
(admittedly bit thin ; still , continuous) microcracked boulders
(about same
dia as the Ni layer) .
when we zoomed scan on them ; we found they're CuSn alloy ! Looks
like a
smallpoxed nickel face .
Now our regular profiling 's telling us we're nowhere near this
alloying
scenarios ;
and we ponder about the cracking propagations ; the Q is :
Where are this aliens coming from ?
Contaminants of tubs from some previous process ?
Smudged sample polish ?
Appears only on one specific fab supply .
Paul Klasek
http://www,resmed,com
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