Hello Technetters not on vacation,

Has anyone seen copper migration within a flex?

I have a test running where I believe this has occurred, but until I get some
SEM and EDX work done, nobody seems to believe me.  The conditions are just
right for electrochemical migration, 85 C/85 %RH, 20 volt bias on 60-mil
space, ionic contaminate (maybe, residual etch chemistry?).  I see dendrites
after 168 hours under test.  The traces are fully covered by the polyimide
cover layers, but I know that the adhesive has an affinity for moisture.

Besides my calls to the fab house and material supplier, I thought I'd ask the
knowledge base here.  How about it?  Any experience you can share?  I have
photos of the affected area (although not very good) that I can share.

Thanks for your help,
Glenn

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