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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 17 Aug 1999 17:20:06 EDT |
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When plating Tin, or Tin/Lead, when the Tin goes to the Stannic state, which
is inevitable in a reasonably short time, and shorter if you let the anode
area get low, the Stannic Tin is insoluble, and forms a Tin Oxide dispersion
in the bath. This oxide co-deposits with the Tin metal that is plated, so
you wind up not with a pure Tin metal deposit, but rather a metal/oxide
co-deposit. This metal/oxide co-deposit is not going to be as proof to
corrosive effects, and will potentially give you interesting results on SIR
and related tests.
However these drawbacks are ONLY for Tin plating. I am unaware of any
problems with other metals.
What specific metal did you have in mind for plating with Methanesulfonate?
Rudy Sedlak
RD Chemical Company
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