TECHNET Archives

July 1999

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From:
dcchambers <[log in to unmask]>
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TechNet E-Mail Forum.
Date:
Thu, 8 Jul 1999 07:42:39 -0600
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SIGN OFF TechNet

-----Original Message-----
From: Automatic digest processor [mailto:[log in to unmask]]
Sent: Wednesday, July 07, 1999 11:00 PM
To: Recipients of TechNet digests
Subject: TechNet Digest - 6 Jul 1999 to 7 Jul 1999 (#1999-16)


There are 16 messages totalling 733 lines in this issue.

Topics of the day:

  1. AMRC 1997 report
  2. Prepregs
  3. "Solderability Testing" In Use
  4. AW: [TN] adhesive to solder mask adherence issue
  5. J-STD-003, Sect. 1.8, Coating Durability
  6. IPC Makes Lead Free Technical Papers Available for Free Download
  7. PEM's in PWB's
  8. Magnet wire insulation criteria
  9. [LF] "Drop-In" Replacement (2)
 10. Cu thickness varies from panel to panel
 11. SIGN OFF (2)
 12. Conformal Coating (2)
 13. R-Pak Wavesolder Footprint

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