TECHNET Archives

July 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Christopher Jorgensen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Jul 1999 11:27:13 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines)
Dear colleague,

IPC has made technical papers on lead-free electronics assemblies and the Surface
Mount Council White Paper, An Assessment of the Use of Lead in Electronic Assembly,
available for free download. To view the list of available papers and download the
files, go to:

http://www.ipc.org/html/leadfree.htm

As more papers are made available, they will be posted on the web site and their
availability announced on [log in to unmask]

If you have not yet subscribed to the [log in to unmask] e-mail forum and want to stay
up to date on the lead elimination issue, follow the instructions included below

Best,

Chris

Chris Jorgensen
Technical Project Manager
IPCWorks '99 Conference Coordinator

An International Summit on Lead-Free Electronics Assemblies
October 25 - 28, 1999
Hyatt Regency, Minneapolis, MN

To stay on top of the lead elimination issue, subscribe to the [log in to unmask]
e-mail forum.

To subscribe compose the following email message:
TO: [log in to unmask]
SUBJECT: (leave blank)
MESSAGE: subscribe leadfree YOUR NAME

ATOM RSS1 RSS2