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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 7 Jul 1999 17:03:58 +0200 |
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Hi Cory
Because we have to lacquer our pcb's the adhereance issue is also important
for us. We have seen solder masks as well as fluxers as well as conformal
coatings which decreases the adhereance of between conformal coating and
solder mask dramatically. Some adhereance killer resists to all usable
cleaning processes (isopropanole, saponifier, FCKW). Sometimes a very smoth
finish indicates the presence of polyglycoles.
If your pcb supplier uses two or more solder resists, you could try to find
a difference between this types. Also may there is a difference between
pcb's after soldering (with fluxer) and without.
Bernhard
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Von: Cory and Lise Steeby[SMTP:[log in to unmask]]
Gesendet: Freitag, 2. Juli 1999 19:22
An: [log in to unmask]
Betreff: [TN] adhesive to solder mask adherence issue
We are using adhesive to place SMD components and are seeing the
something
fail in the adhesive system. Parts are falling off the board prior
to the
wave soldering process and the cured adhesive does not pass the
"snap" test.
When parts are snapped off the board the glue remains on the part
and the
PCB is clean. The problem did not show up in earlier runs of
identical
product. We have investigated the PCB fabricators process, the
adhesive
curing process and the adhesive. Does anyone have any advice?
The adhesive is Loctite 3614
The mask is Hysol SR1010G
Thanks in advance,
Cory Steeby
EBW Electronics, Inc
701 Commerce CT
Holland, MI 49424
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